HiSilicon Technologies, the semiconductor arm of Huawei, announced on November 3 the mass production of its first self-developed PIR sensor chip HS3200, ending the long-term dependence of Chinese manufacturers on imported chips from Texas Instruments and罗姆半导体 (ROHM Semiconductor). The chip has obtained supply qualification from 10 major domestic sensor manufacturers including Hikvision, Dahua, and Aqara, with an initial monthly production capacity of 2 million units.
The HS3200 integrates a low-noise amplifier, signal processor, and power management unit into a single 3mm×3mm QFN package, reducing the overall size of sensor modules by 40% compared to solutions using imported chips. It supports a wide operating voltage range of 1.8V-3.6V and has a signal-to-noise ratio (SNR) of 75dB, 10dB higher than the industry benchmark. “The HS3200’s mass production reduces the chip cost for domestic PIR sensors by 30%,” said Wang Jian, HiSilicon’s Sensor Chip Department Manager. “We’ve applied for 12 core patents, covering pyroelectric material matching and signal processing algorithms. By Q1 2026, we aim to increase monthly capacity to 5 million units, capturing 30% of the domestic mid-to-high-end PIR chip market.”